- 专利标题: Connecting power leads to circuit board
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申请号: US14375237申请日: 2013-01-29
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公开(公告)号: US09661757B2公开(公告)日: 2017-05-23
- 发明人: Peter Andrew John Finn
- 申请人: Peter Andrew John Finn
- 申请人地址: US MA Westborough
- 专利权人: NEC Energy Solutions, Inc.
- 当前专利权人: NEC Energy Solutions, Inc.
- 当前专利权人地址: US MA Westborough
- 代理机构: Chapin IP Law, LLC
- 国际申请: PCT/US2013/023544 WO 20130129
- 国际公布: WO2013/116184 WO 20130808
- 主分类号: H05K3/34
- IPC分类号: H05K3/34 ; H01R12/51 ; H05K1/18 ; H01R12/58 ; H05K1/11 ; H05K1/14 ; H05K3/10 ; H01M2/20
摘要:
An assembler receives a circuit board. The circuit board includes at least a first node and a second node that are adjacent but electrically isolated from each other. There is a gap between the first node and the second node. The first node is electrically isolated from other components on the circuit board. The second node is electrically coupled to circuitry residing on the circuit board. The assembler initiates positioning of a conductive lead of a battery in a vicinity of the first node. The gap between the first node and second node initially prevents the live conductive lead from being in electrical contact with the second node. Eventually, the assembler bridges the gap to provide an electrical connection between at least the conductive lead and the second node to electrically couple the conductive lead to the second node and thus the circuitry residing on the circuit board.
公开/授权文献
- US20150008027A1 CONNECTING POWER LEADS TO CIRCUIT BOARD 公开/授权日:2015-01-08
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