Invention Grant
- Patent Title: Apparatus and methods for scalable photonic packet architectures using PIC switches
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Application No.: US14695970Application Date: 2015-04-24
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Publication No.: US09658403B2Publication Date: 2017-05-23
- Inventor: Hamid Mehrvar , Huixiao Ma , Eric Bernier
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Slater Matsil, LLP
- Main IPC: G02B6/35
- IPC: G02B6/35 ; H04Q11/00

Abstract:
Embodiments are provided for scalable photonic packet fabric architectures using photonic integrated circuit switches. The architectures use compact size silicon photonic circuits that can be arranged in a combined centralized and distributed manner. In an embodiment, an optical switch structure comprises a plurality of core photonic based switches and a plurality of photonic interface units (PIUs) optically coupled to the core photonic based switches and to a plurality of groups of top-of-rack switches (TORs). Each PIU comprises a N×N silicon photonic (SiP) switch optically coupled to a group of TORs associated with the PIU from the groups of TORs, where N is a number of the TORs in each group. The PIU also comprises a plurality of 1×P SiP switches coupled to the group of TORs associated with the PIU and to the core photonic based switches, where P is a number of the core photonic based switches.
Public/Granted literature
- US20150309265A1 Apparatus and Methods for Scalable Photonic Packet Architectures Using PIC Switches Public/Granted day:2015-10-29
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