Invention Grant
- Patent Title: Floorplan-optimized stacked image sensor and associated methods
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Application No.: US14246859Application Date: 2014-04-07
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Publication No.: US09652575B2Publication Date: 2017-05-16
- Inventor: Jie Shen
- Applicant: OmniVision Technologies, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lathrop & Gage LLP
- Main IPC: G06F17/50
- IPC: G06F17/50 ; H01L27/146

Abstract:
A floorplan-optimized stacked image sensor and a method for designing the sensor are disclosed. A sensor layer includes multiple PSAs partitioned into PSA groups. A circuit layer includes multiple analog-to-digital converters each communicatively coupled to a different PSA. Each analog-to-digital converter (ADC) is semi-aligned to the PSA group associated with the PSA to which it is communicatively coupled. The floorplan of ADCs maximizes contiguous global-based space on the circuit layer uninterrupted by an ADC. The resulting circuit layer floorplan has one or more global-based spaces interleaved with one or more local-based spaces containing ADCs.
Public/Granted literature
- US20150288908A1 Floorplan-Optimized Stacked Image Sensor And Associated Methods Public/Granted day:2015-10-08
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