Invention Grant
- Patent Title: Manufacturing method for an electrowetting device
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Application No.: US14204081Application Date: 2014-03-11
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Publication No.: US09651771B2Publication Date: 2017-05-16
- Inventor: Ivar Schram , Akira Nakasuga , Bokke Johannes Feenstra
- Applicant: SEKISUI CHEMICAL CO., LTD , Amazon Technologies, Inc.
- Applicant Address: US WA Seattle
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US WA Seattle
- Agency: EIP US LLP
- Priority: GB1007199.1 20100429; JP2010-214143 20100924; JP2010-214144 20100924
- Main IPC: G02B26/00
- IPC: G02B26/00

Abstract:
A method of providing a layer of a first fluid and a layer of a second fluid on a first area of a support plate of an electrowetting device includes providing an emulsion of dispersed first fluid and continuous second fluid, the emulsion including an amount of the second fluid for forming the layer of the second fluid.
Public/Granted literature
- US20140192396A1 MANUFACTURING METHOD FOR AN ELECTROWETTING DEVICE Public/Granted day:2014-07-10
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