- 专利标题: Antifungal compound and uses thereof
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申请号: US14095757申请日: 2013-12-03
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公开(公告)号: US09642829B2公开(公告)日: 2017-05-09
- 发明人: Chaminda Jayampath Seneviratne , Yi Tsun Richard Kao , Lakshman Perera Samaranayake , Kwok Yung Yuen , Dan Yang , Yu Wang , Sze Wah Sarah Wong
- 申请人: The University of Hong Kong
- 申请人地址: CN Hong Kong
- 专利权人: THE UNIVERSITY OF HONG KONG
- 当前专利权人: THE UNIVERSITY OF HONG KONG
- 当前专利权人地址: CN Hong Kong
- 代理机构: Leason Ellis LLP
- 主分类号: C07D309/34
- IPC分类号: C07D309/34 ; A61K31/351 ; A01N43/40 ; A01N59/00 ; A61K9/00 ; A61K9/08
摘要:
Disclosed herein is a novel antifungal compound, derivatives that are used to treat fungal infections. In a specific embodiment, the compound is a small molecule. In a specific embodiment, the compound described herein inhibits yeast to hypha transition under robust hyphal inducing conditions at lower concentration of the molecule. Also disclosed is a composition comprising the antifungal compound. In a specific embodiment, the composition is a pharmaceutical composition. Also disclosed is a method of treating and/or preventing fungal infection using the disclosed compound. The disclosed compound exhibits antifungal activity against wide range of fungal species at slightly higher concentrations. Antifungal compound disclosed herein is used as anti-biofilm agent against fungal infections.
公开/授权文献
- US20140155478A1 ANTIFUNGAL COMPOUND AND USES THEREOF 公开/授权日:2014-06-05
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