A method for manufacturing a protector for a portable electronic device includes following steps. A substrate having a first surface, a second surface and an edge is provided. A first sheet having a first sheet surface and an edge portion is provided, wherein the first sheet surface includes a first hot-melt adhesive. The first surface of the substrate is caused to contact the first sheet surface, wherein the edge portion protrudes the edge. The edge portion is folded along the edge to enable the first hot-melt adhesive to contact the second surface of the substrate. A second sheet having a second sheet surface including a second hot-melt adhesive is provided. The second surface of the substrate and the edge portion is caused to contact the second sheet surface. A thermocompression bonding is performed to bond the first sheet, the second sheet and the substrate together.