- 专利标题： Chip package including recess in side edge
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申请号： US14618413申请日： 2015-02-10
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公开(公告)号： US09601460B2公开(公告)日： 2017-03-21
- 发明人: Yen-Shih Ho , Tsang-Yu Liu , Chia-Sheng Lin , Chia-Ming Cheng , Shu-Ming Chang , Tzu-Wen Tseng
- 申请人： XINTEC INC.
- 申请人地址： TW Tauyuan
- 专利权人： XINTEC INC.
- 当前专利权人： XINTEC INC.
- 当前专利权人地址： TW Tauyuan
- 代理机构： Liu & Liu
- 优先权： TW103104366A 20140211
- 主分类号： H01L23/06
- IPC分类号： H01L23/06 ; H01L23/00 ; H01L23/31 ; H01L29/06 ; H01L23/525
摘要：
A chip package including a semiconductor substrate is provided. A recess is in the semiconductor substrate and adjoins a side edge of the semiconductor substrate, wherein the semiconductor substrate has at least one spacer protruding from the bottom of the recess. A conducting layer is disposed on the semiconductor substrate and extends into the recess.
公开/授权文献
- US20150228536A1 CHIP PACKAGE AND METHOD FOR FORMING THE SAME 公开/授权日：2015-08-13
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