Invention Grant
- Patent Title: Distributed bulk onboarding process
- Patent Title (中): 分散式批量上载过程
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Application No.: US14812186Application Date: 2015-07-29
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Publication No.: US09596603B2Publication Date: 2017-03-14
- Inventor: Brian J. Spencer , Wayne Lee , Kenneth Swinson
- Applicant: Qualcomm Connected Experiences, Inc.
- Applicant Address: US CA San Diego
- Assignee: Qualcomm Connected Experiences, Inc.
- Current Assignee: Qualcomm Connected Experiences, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Neugeboren O'Dowd PC
- Main IPC: H04W12/08
- IPC: H04W12/08 ; H04W48/12 ; H04W84/12

Abstract:
Methods and systems for the distributed bulk onboarding of devices onto a Wi-Fi network are provided. A method may comprise receiving, at an onboarding device, Wi-Fi configuration information. Then, it may comprise detecting, at the onboarding device, broadcast information from a plurality of devices that may be onboarded onto the Wi-Fi network, the broadcast information indicating that one or more of the plurality of devices is an onboarding node capable of onboarding another of the plurality of devices. The method may further comprise creating instructions indicating an order in which the plurality of devices may be onboarded, and by which of the one or more onboarding nodes each of the remaining devices of the plurality shall be onboarded, and providing the Wi-Fi configuration information and at least a portion of the instructions to at least one of the onboarding nodes.
Public/Granted literature
- US20160037436A1 DISTRIBUTED BULK ONBOARDING PROCESS Public/Granted day:2016-02-04
Information query