Invention Grant
- Patent Title: High insertion force ejector
- Patent Title (中): 高插拔力喷射器
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Application No.: US13728115Application Date: 2012-12-27
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Publication No.: US09585283B2Publication Date: 2017-02-28
- Inventor: Vic Hong Chia , Mandy Hin Lam , Frank Jun , Hong Tran Huynh
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Merchant & Gould P.C.
- Main IPC: H01R13/62
- IPC: H01R13/62 ; H05K7/14 ; H01R13/629
Abstract:
A high insertion force ejector is provided. The high insertion force ejector includes an ejector mounting base, a pressure bar-ejector tooth, a first cam, and a second cam. The pressure bar-ejector tooth is connected to the ejector mounting base. A lever handle is operatively connected to the pressure bar-ejector and the ejector mounting base. The first cam and the second cam are operatively connected to the pressure bar-ejector tooth and the lever handle.
Public/Granted literature
- US20140187068A1 High Insertion Force Ejector Public/Granted day:2014-07-03
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