发明授权
- 专利标题： Interconnecting structure for electrically connecting a first electronic device with a second electronic device
- 专利标题（中）： 用于将第一电子设备与第二电子设备电连接的互连结构
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申请号： US14204694申请日： 2014-03-11
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公开(公告)号： US09577308B2公开(公告)日： 2017-02-21
- 发明人: Chun-Hsing Li , Chien-Nan Kuo , Chun-Lin Ko
- 申请人： National Chiao Tung University
- 申请人地址： TW
- 专利权人： NATIONAL CHAIO TUNG UNIVERSITY
- 当前专利权人： NATIONAL CHAIO TUNG UNIVERSITY
- 当前专利权人地址： TW
- 代理机构： Volpe and Koenig, P.C.
- 优先权： TW102133052A 20130912
- 主分类号： H01P5/02
- IPC分类号： H01P5/02 ; H01P1/04 ; H01L23/00 ; H01P3/02 ; H01L23/64
摘要：
An interconnecting structure for electrically connecting a first electronic device with a second electronic device is provided. The first electronic device has two first bond-pads, and the second electronic device has two second bond-pads electrically connected to the two first bond-pads respectively. The interconnecting structure includes a signal transmission structure electrically connected to the two first bond-pads and the two second bond-pads; and a ground device disposed between the first electronic device and the second electronic device so that the first electronic device and the second electronic device have a same ground potential.
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