Invention Grant
- Patent Title: Back-to-back stacked integrated circuit assembly
- Patent Title (中): 背对背堆叠集成电路组件
-
Application No.: US15130721Application Date: 2016-04-15
-
Publication No.: US09576937B2Publication Date: 2017-02-21
- Inventor: Michael A. Stuber , Stuart B. Molin
- Applicant: QUALCOMM INCORPORATED
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Haynes and Boone, LLP
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L21/78 ; H01L25/00 ; H01L21/683 ; H01L23/00
Abstract:
An integrated circuit assembly includes a first substrate and a second substrate, with active layers formed on the first surfaces of each substrate, and with the second surfaces of each substrate coupled together. A method of fabricating an integrated circuit assembly includes forming active layers on the first surfaces of each of two substrates, and coupling the second surfaces of the substrates together.
Public/Granted literature
- US20160233198A1 Back-to-back stacked integrated circuit assembly Public/Granted day:2016-08-11
Information query
IPC分类:
