发明授权
US09559076B2 Package having substrate with embedded metal trace overlapped by landing pad
有权
具有嵌入金属轨迹的衬底的封装与着陆焊盘重叠
- 专利标题： Package having substrate with embedded metal trace overlapped by landing pad
- 专利标题（中）： 具有嵌入金属轨迹的衬底的封装与着陆焊盘重叠
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申请号： US15085352申请日： 2016-03-30
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公开(公告)号： US09559076B2公开(公告)日： 2017-01-31
- 发明人: Mirng-Ji Lii , Yu-Min Liang , Yu-Feng Chen
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater Matsil, LLP
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/00
摘要：
An embodiment package includes a conductive pillar mounted on an integrated circuit chip, the conductive pillar having a stepper shape, a metal trace partially embedded in a substrate, the metal trace having a bonding pad portion protruding from the substrate, and a solder feature electrically coupling the conductive pillar to the bonding pad portion of the metal trace.
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