Invention Grant
- Patent Title: Heat exchanger
- Patent Title (中): 热交换器
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Application No.: US13874933Application Date: 2013-05-01
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Publication No.: US09557121B2Publication Date: 2017-01-31
- Inventor: Taegyun Park , Sehyeon Kim , Seungmo Jung , Eungyul Lee , Sanghoon Yoo , Naehyun Park
- Applicant: LG Electronics Inc.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Agency: Dentons US LLP
- Priority: KR10-2012-0047565 20120504
- Main IPC: F28F9/04
- IPC: F28F9/04 ; F28F9/02 ; F28D1/053 ; F28F1/32 ; F28D21/00

Abstract:
Provided is a heat exchanger. The heat exchanger includes a plurality of refrigerant tubes in which a refrigerant flows, a heat dissipation-fin in which the plurality of refrigerant tubes are inserted and through which the refrigerant and a fluid are heat-exchanged with each other, a header coupled to at least one side of the plurality of refrigerant tubes to define a refrigerant flow space, and a guide device disposed within the header to branch the refrigerant into a plurality of passages corresponding to the plurality of refrigerant tubes.
Public/Granted literature
- US20130292104A1 HEAT EXCHANGER Public/Granted day:2013-11-07
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