Invention Grant
- Patent Title: Interconnection apparatus and method using terahertz waves
- Patent Title (中): 使用太赫兹波的互连装置和方法
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Application No.: US13907582Application Date: 2013-05-31
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Publication No.: US09553678B2Publication Date: 2017-01-24
- Inventor: Kyung-Hyun Park , Han-Cheol Ryu , Jeong-Woo Park , Sang-Pil Han , Nam-Je Kim
- Applicant: Electronics and Telecommunications Research Institute
- Applicant Address: KR Daejeon
- Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee Address: KR Daejeon
- Priority: KR10-2012-0058307 20120531; KR10-2013-0040094 20130411
- Main IPC: H04B10/90
- IPC: H04B10/90 ; H04B10/80

Abstract:
Disclosed herein is an interconnection apparatus and method using terahertz waves. The interconnection apparatus using terahertz waves according to the present invention includes a first terahertz wave generation unit for generating a first transmission terahertz wave, a center frequency of which is a first center frequency, using photomixing. A second terahertz wave generation unit generates a second transmission terahertz wave, a center frequency of which is a second center frequency different from the first center frequency. A first terahertz wave detection unit detects a first reception terahertz wave corresponding to the first transmission terahertz wave. A second terahertz wave detection unit detects a second reception terahertz wave corresponding to the second transmission terahertz wave.
Public/Granted literature
- US20130320215A1 INTERCONNECTION APPARATUS AND METHOD USING TERAHERTZ WAVES Public/Granted day:2013-12-05
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