发明授权
- 专利标题: Low stress compact device packages
- 专利标题(中): 低应力小型设备封装
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申请号: US14567801申请日: 2014-12-11
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公开(公告)号: US09533878B2公开(公告)日: 2017-01-03
- 发明人: Thomas M. Goida , Kathleen O'Donnell , Michael Delaus
- 申请人: ANALOG DEVICES, INC.
- 申请人地址: US MA Norwood
- 专利权人: ANALOG DEVICES, INC.
- 当前专利权人: ANALOG DEVICES, INC.
- 当前专利权人地址: US MA Norwood
- 代理机构: Knobbe, Martens, Olson & Bear LLP
- 主分类号: H01L23/495
- IPC分类号: H01L23/495 ; B81B7/00 ; B81C1/00 ; H01L25/18 ; H01L23/498 ; H01L23/13 ; H01L23/34 ; H01L23/00
摘要:
Various low stress compact device packages are disclosed herein. An integrated device package can include a first integrated device die and a second integrated device die. An interposer can be disposed between the first integrated device die and the second integrated device die such that the first integrated device die is mounted to and electrically coupled to a first side of the interposer and the second integrated device die is mounted to and electrically coupled to a second side of the interposer. The first side can be opposite the second side. The interposer can comprise a hole through at least the second side of the interposer. A portion of the second integrated device die can extend into the hole.
公开/授权文献
- US20160167951A1 LOW STRESS COMPACT DEVICE PACKAGES 公开/授权日:2016-06-16
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