发明授权
- 专利标题: Sensor over-mold shape
- 专利标题(中): 传感器过模具形状
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申请号: US13362371申请日: 2012-01-31
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公开(公告)号: US09517032B2公开(公告)日: 2016-12-13
- 发明人: Daniel S. Flo , James K. Carney , Kamal Deep Mothilal , Jon D. Schell
- 申请人: Daniel S. Flo , James K. Carney , Kamal Deep Mothilal , Jon D. Schell
- 申请人地址: US MN Minneapolis
- 专利权人: Medtronic, Inc.
- 当前专利权人: Medtronic, Inc.
- 当前专利权人地址: US MN Minneapolis
- 代理商 Evans M. Mburu
- 主分类号: G01L7/00
- IPC分类号: G01L7/00 ; A61B5/00 ; A61B5/0215 ; G01L19/14
摘要:
An implantable sensor module and medical device includes a housing having an inner shell having a thickness extending between an inner wall and an outer wall and an outer layer, wherein the inner shell and the outer layer form a substantially flat portion. A shoulder extends adjacent to a diaphragm to extend the outer layer laterally away from a central medial line extending between edges of the diaphragm. A recess portion is formed between the diaphragm and an inner side of the outer layer, and an over-fill channel is formed by the outer layer extending through the outer layer from an opening formed at the outer wall to an opening formed along the inner side of the outer layer extending along the substantially flat portion.
公开/授权文献
- US20130197336A1 SENSOR OVER-MOLD SHAPE 公开/授权日:2013-08-01
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