发明授权
- 专利标题： Electronic component embedded substrate and manufacturing method thereof
- 专利标题（中）： 电子元件嵌入式基板及其制造方法
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申请号： US14219768申请日： 2014-03-19
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公开(公告)号： US09510455B2公开(公告)日： 2016-11-29
- 发明人: Bong-Soo Kim
- 申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 代理机构： NSIP Law
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H05K3/46
摘要：
The present invention discloses an electronic component embedded substrate and a manufacturing method thereof. The electronic component embedded substrate in accordance with an embodiment of the present invention includes: a core board having a cavity formed therein; an electronic component being embedded in the cavity; and a circuit pattern formed on one surface of the core board and configured for fixing the electronic component in the cavity by pressing the electronic component.
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