Invention Grant
- Patent Title: Panel
- Patent Title (中): 面板
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Application No.: US14468325Application Date: 2014-08-25
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Publication No.: US09477344B2Publication Date: 2016-10-25
- Inventor: Ying-Ting Liou , Kai-Ting Tsai , Ming-Cheng Tsai , Chun-Ming Huang
- Applicant: WINTEK CORPORATION
- Applicant Address: TW Taichung
- Assignee: WINTEK CORPORATION
- Current Assignee: WINTEK CORPORATION
- Current Assignee Address: TW Taichung
- Agency: Sinorica, LLC
- Agent Ming Chow
- Priority: TW102215986U 20130826
- Main IPC: B32B3/00
- IPC: B32B3/00 ; G06F3/041 ; H05K3/28 ; G02F1/1345
Abstract:
A panel including a substrate, a plurality of wirings and a protection stacked layer is provided. The substrate has a device area, a bonding area and a wiring area connected between the device area and the bonding area. The wirings extend from the device area to the bonding area through the wiring area. The protection stacked layer extends from a side of the wiring area adjacent to the device area towards a side of the bonding area and is located on the wirings.
Public/Granted literature
- US20150053461A1 PANEL Public/Granted day:2015-02-26
Information query
