Invention Grant
- Patent Title: Stacked semiconductor chips packaging
- Patent Title (中): 堆叠半导体芯片封装
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Application No.: US14737716Application Date: 2015-06-12
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Publication No.: US09449907B2Publication Date: 2016-09-20
- Inventor: Lei Fu , Frank Gottfried Kuechenmeister , Michael Zhuoying Su
- Applicant: Advanced Micro Devices, Inc.
- Applicant Address: US CA Sunnyvale
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Faegre Baker & Daniels LLP
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L25/07 ; H01L23/498 ; H01L21/768 ; H01L25/065 ; H01L25/00 ; H01L23/48
Abstract:
Various methods and apparatus for joining stacked substrates to a circuit board are disclosed. In one aspect, a method of manufacturing is provided that includes coupling plural substrates to form a stack. At least one of the plural substrates is a semiconductor chip. Plural conductive vias are formed in a first of the plural substrates. Each of the plural conductive vias includes a first end positioned in the first substrate and a second end projecting out of the first substrate.
Public/Granted literature
- US20150279773A1 STACKED SEMICONDUCTOR CHIPS PACKAGING Public/Granted day:2015-10-01
Information query
IPC分类:
