Pressure pad for a heat-sealing device in a packaging machine, the heat-sealing device having a heat-sealing jaw and a counter-jaw adapted to seal together two surfaces of a packaging material when the jaws are pressed together. The pressure pad comprises a first portion, adapted to be mounted on the counter-jaw of the heat-sealing device, and a second portion, in use arranged towards the heat-sealing jaw of the heat-sealing device. A cross-section of said second portion, along the extension of the pressure pad, has a substantially constant arc-shape of the outer contact surface in use facing the heat-sealing jaw. The pressure pad is made up of a resilient material, and the cross-section of said arc-shaped outer contact surface has a radius of curvature of 15 mm±5 mm. The invention further relates to a heat-sealing device having such a pressure pad.