发明授权
- 专利标题： Packaging through pre-formed metal pins
- 专利标题（中）： 通过预先形成的金属销包装
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申请号： US14153691申请日： 2014-01-13
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公开(公告)号： US09418953B2公开(公告)日： 2016-08-16
- 发明人: Chen-Hua Yu , Chien Ling Hwang , Yeong-Jyh Lin
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater Matsil, LLP
- 主分类号： H01L23/00
- IPC分类号： H01L23/00
摘要：
A package includes first package component and a second package component. The first package component includes a first electrical connector at a surface of the first package component, and a first solder region on a surface of the first electrical connector. The second package component includes a second electrical connector at a surface of the second package component, and a second solder region on a surface of the second electrical connector. A metal pin has a first end bonded to the first solder region, and a second end bonded to the second solder region.
公开/授权文献
- US20150200171A1 Packaging through Pre-Formed Metal Pins 公开/授权日：2015-07-16
信息查询
IPC分类:
