发明授权
- 专利标题: Method for transferring light-emitting elements onto a package substrate
- 专利标题(中): 将发光元件转印到封装衬底上的方法
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申请号: US14952227申请日: 2015-11-25
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公开(公告)号: US09412912B2公开(公告)日: 2016-08-09
- 发明人: Ching-Liang Lin , Yu-Hung Lai , Tzu-Yang Lin , Pei-Hsin Chen
- 申请人: PLAYNITRIDE INC.
- 申请人地址: TW Tainan
- 专利权人: Playnitride, Inc.
- 当前专利权人: Playnitride, Inc.
- 当前专利权人地址: TW Tainan
- 代理机构: LeClairRyan
- 优先权: TW103141778A 20141202
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; H01L33/48 ; H01L23/00 ; H01L25/075 ; H01L33/62 ; H01L25/00
摘要:
A method for transferring light-emitting elements onto a package substrate includes: providing a light-emitting unit including a temporary substrate and light-emitting elements; disconnecting the light-emitting elements from the temporary substrate to allow the light-emitting elements to float on a fluid; adjusting spacings between the light-emitting elements to have a predetermined size by controlling flow of the fluid; placing a package substrate into the fluid, followed by aligning the light-emitting elements with connecting pads of the package substrate so as to correspondingly place the light-emitting elements on the connecting pads; and removing the package substrate with the light-emitting elements from the fluid.
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