Invention Grant
US09412509B2 Multilayer electronic component having conductive patterns and board having the same
有权
具有导电图案的多层电子部件和具有该图案的板
- Patent Title: Multilayer electronic component having conductive patterns and board having the same
- Patent Title (中): 具有导电图案的多层电子部件和具有该图案的板
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Application No.: US14504107Application Date: 2014-10-01
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Publication No.: US09412509B2Publication Date: 2016-08-09
- Inventor: Jeong Hwan Im , So Young Jun , Hyun Ju Jung , Sung Jin Park , Young Jin Ha
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2014-0077158 20140624
- Main IPC: H01F27/28
- IPC: H01F27/28

Abstract:
A multilayer electronic component may include: a multilayer body including a plurality of insulating layers; an internal coil part provided by electrically connecting respective conductive patterns disposed on the plurality of insulating layers to each other; and first and second external electrodes disposed on both end surfaces of the multilayer body, respectively. A perimeter of at least one conductive pattern disposed in peripheral regions of the multilayer body may be smaller than a perimeter of a conductive pattern disposed in a central region of the multilayer body.
Public/Granted literature
- US20150371755A1 MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME Public/Granted day:2015-12-24
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