发明授权
US09412509B2 Multilayer electronic component having conductive patterns and board having the same
有权
具有导电图案的多层电子部件和具有该图案的板
- 专利标题: Multilayer electronic component having conductive patterns and board having the same
- 专利标题(中): 具有导电图案的多层电子部件和具有该图案的板
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申请号: US14504107申请日: 2014-10-01
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公开(公告)号: US09412509B2公开(公告)日: 2016-08-09
- 发明人: Jeong Hwan Im , So Young Jun , Hyun Ju Jung , Sung Jin Park , Young Jin Ha
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si, Gyeonggi-do
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Suwon-si, Gyeonggi-do
- 代理机构: McDermott Will & Emery LLP
- 优先权: KR10-2014-0077158 20140624
- 主分类号: H01F27/28
- IPC分类号: H01F27/28
摘要:
A multilayer electronic component may include: a multilayer body including a plurality of insulating layers; an internal coil part provided by electrically connecting respective conductive patterns disposed on the plurality of insulating layers to each other; and first and second external electrodes disposed on both end surfaces of the multilayer body, respectively. A perimeter of at least one conductive pattern disposed in peripheral regions of the multilayer body may be smaller than a perimeter of a conductive pattern disposed in a central region of the multilayer body.
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