发明授权
US09408306B2 Antenna array feeding structure having circuit boards connected by at least one solderable pin
有权
具有由至少一个可焊接引脚连接的电路板的天线阵列馈电结构
- 专利标题: Antenna array feeding structure having circuit boards connected by at least one solderable pin
- 专利标题(中): 具有由至少一个可焊接引脚连接的电路板的天线阵列馈电结构
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申请号: US14155920申请日: 2014-01-15
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公开(公告)号: US09408306B2公开(公告)日: 2016-08-02
- 发明人: Nan Wang , Orville Nyhus , Chao Wang
- 申请人: Honeywell International Inc.
- 申请人地址: US NJ Morris Plains
- 专利权人: Honeywell International Inc.
- 当前专利权人: Honeywell International Inc.
- 当前专利权人地址: US NJ Morris Plains
- 代理机构: Fogg & Powers LLC
- 主分类号: H05K1/14
- IPC分类号: H05K1/14 ; H01Q21/00 ; H05K1/02 ; H05K1/11 ; H05K3/46 ; H05K3/10 ; H01Q1/00 ; H01P3/08 ; H01Q1/24 ; H01Q1/50
摘要:
Systems and methods for a feeding structure for an antenna array are provided. In at least one embodiment, the feeding structure for an antenna array comprises one or more circuit boards with one or more circuits formed thereon, one or more conductive layers wherein the one or more circuit boards are mounted to the one or more conductive layers, and one or more connectors coupled to the one or more circuits through an opening in the one or more conductive layers. Furthermore, the one or more conductive layers are separated by a dielectric from the one or more circuits and the one or more conductive layers contact the one or more circuit boards such that the one or more circuits are isolated from the one or more conductive layers.
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