A wafer inspection interface 18 includes a probe card 20 having multiple probes 25 at a surface of the probe card 20 facing a wafer W, the probes 25 being arranged to correspond to electrodes of multiple semiconductor devices formed on the wafer W; a pogo frame 40 that is in contact with a surface of the probe card 20 opposite to the surface of the probe card 20 facing the wafer W and supports the probe card 20; and a sheath heater 44 provided in the pogo frame 40. The sheath heater 44 is provided along respective sides of through holes 43 formed in the pogo frame 40 in a grid pattern.