Invention Grant
- Patent Title: Elliptic curve point multiplication procedure resistant to side-channel information leakage
- Patent Title (中): 椭圆曲线点乘法程序抗侧信道泄漏
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Application No.: US14245732Application Date: 2014-04-04
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Publication No.: US09391773B2Publication Date: 2016-07-12
- Inventor: David Merrill Jacobson , Billy Bob Brumley
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loza, LLP
- Main IPC: H04L9/30
- IPC: H04L9/30 ; G06F7/72 ; H04L9/00

Abstract:
One feature pertains to elliptic curve (EC) point multiplication for use in generating digital signatures. In one aspect, a scalar multiplier (k) of a base point (P) of order (n) is selected on an elliptic curve for use with EC point multiplication. An integer value (r) is then randomly generated from within a range of values constrained so that, regardless of the particular value of (r) obtained within the range, EC point multiplication procedures performed using the scalar multiplier (k) summed with a product of the integer multiplier (r) and the order (n) consume device resources independent of the value of the scalar multiplier (k) to thereby reduce or eliminate side-channel leakage. This may be achieved by determining the range of values for r so that the bit position of the most significant bit of k+(r*n) will be even and fixed for a particular elliptic curve.
Public/Granted literature
- US20150288520A1 ELLIPTIC CURVE POINT MULTIPLICATION PROCEDURE RESISTANT TO SIDE-CHANNEL INFORMATION LEAKAGE Public/Granted day:2015-10-08
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