A semiconductor device includes: a semiconductor chip having a main face which has a pair of long sides parallel to each other and a pair of short sides orthogonal to the pair of long sides; first bumps arrayed in a first bump placement region of the semiconductor chip, the first bump placement region being positioned along one of the pair of long sides; second bumps arrayed in a second bump placement region of the semiconductor chip, the second bump placement region being positioned along the other of the pair of long sides; first power lines disposed in a region between the first bump placement region and the second bump placement region, the first power lines extending in a direction parallel to the pair of long sides; and third bumps integrated on the semiconductor chip. Each of the third bumps provides short-circuiting of the first power lines.