发明授权
- 专利标题: Solid state thermal rectifier
- 专利标题(中): 固态热整流器
-
申请号: US12444149申请日: 2007-10-02
-
公开(公告)号: US09385065B2公开(公告)日: 2016-07-05
- 发明人: Chih-Wei Chang , Arunava Majumdar , Alexander K. Zettl
- 申请人: Chih-Wei Chang , Arunava Majumdar , Alexander K. Zettl
- 申请人地址: US CA Oakland
- 专利权人: The Regents of the University of California
- 当前专利权人: The Regents of the University of California
- 当前专利权人地址: US CA Oakland
- 代理机构: Lawrence Berkeley National Laboratory
- 国际申请: PCT/US2007/080230 WO 20071002
- 国际公布: WO2008/042920 WO 20080410
- 主分类号: B32B9/00
- IPC分类号: B32B9/00 ; H01L23/373 ; C01B31/02 ; F28F13/00 ; F28F21/02 ; B82Y10/00 ; B82Y30/00
摘要:
Thermal rectifiers using linear nanostructures as core thermal conductors have been fabricated. A high mass density material is added preferentially to one end of the nanostructures to produce an axially non-uniform mass distribution. The resulting nanoscale system conducts heat asymmetrically with greatest heat flow in the direction of decreasing mass density. Thermal rectification has been demonstrated for linear nanostructures that are electrical insulators, such as boron nitride nanotubes, and for nanostructures that are conductive, such as carbon nanotubes.
公开/授权文献
- US20100167004A1 SOLID STATE THERMAL RECTIFIER 公开/授权日:2010-07-01
信息查询