发明授权
- 专利标题： Laminate sub-mounts for LED surface mount package
- 专利标题（中）： 用于LED表面贴装的层压用底座
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申请号： US14505557申请日： 2014-10-03
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公开(公告)号： US09379298B2公开(公告)日： 2016-06-28
- 发明人: Justin Kolbe , Steve Taylor
- 申请人： HENKEL IP & HOLDING GMBH
- 申请人地址： DE Duesseldorf
- 专利权人： HENKEL IP & HOLDING GMBH
- 当前专利权人： HENKEL IP & HOLDING GMBH
- 当前专利权人地址： DE Duesseldorf
- 代理商 James J. Cummings
- 主分类号： H01L33/48
- IPC分类号： H01L33/48 ; H01L33/62 ; H01L33/60
摘要：
An LED package is described that acts as a sub-mount between a printed circuit board and an LED. The sub-mount includes a laminate to thermally isolate the LED from the PCB while providing a thermal heat dissipative sink for the LED.
公开/授权文献
- US20160099392A1 Laminate Sub-Mounts for LED Surface Mount Package 公开/授权日：2016-04-07
信息查询
IPC分类:
