A method for manufacturing an LED module is provided that includes the steps of mounting an LED chip 2 on an obverse surface of leads 1A′, 1B′, and after the step of mounting the LED chip 2, providing a case 6 that covers part of the leads 1A′, 1B′ and includes a reflective surface 61 surrounding the LED chip 2 in an in-plane direction of the leads 1A′, 1B′. With this arrangement, there is no risk that the arm for handling the LED chip 2 interferes with the case 6. This allows the distance between the reflective surface 61 and the LED chip 2 to be reduced, and hence allows making the LED module more compact.