发明授权
- 专利标题： Thin integrated circuit chip-on-board assembly
- 专利标题（中）： 薄集成电路芯片组装
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申请号： US14586668申请日： 2014-12-30
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公开(公告)号： US09368468B2公开(公告)日： 2016-06-14
- 发明人: Michael A. Stuber , Stuart B. Molin , Mark Drucker , Peter Fowler
- 申请人： QUALCOMM SWITCH CORP.
- 申请人地址： US CA San Diego
- 专利权人： QUALCOMM SWITCH CORP.
- 当前专利权人： QUALCOMM SWITCH CORP.
- 当前专利权人地址： US CA San Diego
- 代理机构： Haynes and Boone, LLP
- 主分类号： H01L27/01
- IPC分类号： H01L27/01 ; H01L23/00
摘要：
An integrated circuit assembly includes an insulating layer having a having a first surface and a second surface, where the first surface of the insulating layer is less than 10 microns below an upper plane of the integrated circuit assembly. An active layer contacts the first surface of the insulating layer. A metal bond pad is electrically connected to the active layer and formed on the second surface of the insulating layer, and is also electrically connected to a printed circuit board.
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