Invention Grant
- Patent Title: Methods and systems for high bandwidth chip-to-chip communications interface
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Application No.: US14823870Application Date: 2015-08-11
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Publication No.: US09362974B2Publication Date: 2016-06-07
- Inventor: John Fox , Brian Holden , Peter Hunt , John D. Keay , Amin Shokrollahi , Andrew Kevin John Stewart , Giuseppe Surace , Roger Ulrich , Richard Simpson
- Applicant: KANDOU LABS S.A.
- Applicant Address: CH
- Assignee: Kandou Labs, S.A.
- Current Assignee: Kandou Labs, S.A.
- Current Assignee Address: CH
- Agency: Invention Mine LLC
- Main IPC: H04B1/40
- IPC: H04B1/40 ; H04L29/08 ; H03K19/0175 ; H03K19/0185 ; H01L23/14 ; H01L23/538

Abstract:
Systems and methods are described for transmitting data over physical channels to provide a high bandwidth, low latency interface between integrated circuit chips with low power utilization. Communication is performed using group signaling over multiple wires using a vector signaling code, where each wire carries a low-swing signal that may take on more than two signal values.
Public/Granted literature
- US20150349835A1 METHODS AND SYSTEMS FOR HIGH BANDWIDTH CHIP-TO-CHIP COMMUNCATIONS INTERFACE Public/Granted day:2015-12-03
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