发明授权
- 专利标题: Trimmer apparatus
- 专利标题(中): 微调仪器
-
申请号: US14575470申请日: 2014-12-18
-
公开(公告)号: US09358695B2公开(公告)日: 2016-06-07
- 发明人: Kenji Baba , Chiaki Osada , Hirokazu Tanaka
- 申请人: Kenji Baba , Chiaki Osada , Hirokazu Tanaka
- 申请人地址: JP Kawasaki-Shi, Kanagawa
- 专利权人: SEIKO LTD.
- 当前专利权人: SEIKO LTD.
- 当前专利权人地址: JP Kawasaki-Shi, Kanagawa
- 代理商 Manabu Kenesaka
- 优先权: JP2013-262107 20131219; JP2013-262108 20131219; JP2014-146848 20140717
- 主分类号: B26D7/18
- IPC分类号: B26D7/18 ; B26D7/02 ; B26D1/18 ; B26D1/20 ; B26D5/06 ; B26D7/00
摘要:
A trimming apparatus trims by cutter blades running from one end of a sheet bundle to the other end thereof, includes a bed surface for the sheet bundle, cutter blades for cutting the sheet bundle supported on the bed surface, a drive device for running the cutting blades from one end of the sheet bundle to the other end thereof, a support member having a support face, and a shift device for moving the support member between a working position for the support member supporting cut sheet dust pieces and a retreating position not to hinder the cut sheet dust pieces from dropping. The shift device displaces the support face from the working position to a retreating position after the cutter blades move at a predetermined distance toward the other end of the sheet bundle from one end thereof.
公开/授权文献
- US20150174781A1 TRIMMER APPARATUS 公开/授权日:2015-06-25
信息查询