Invention Grant
- Patent Title: Oxide TFT and manufacturing method thereof
- Patent Title (中): 氧化物TFT及其制造方法
-
Application No.: US13880823Application Date: 2012-11-12
-
Publication No.: US09355838B2Publication Date: 2016-05-31
- Inventor: Zuqiang Wang , Won Seok Kim , Zhengping Xiong
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Beijing CN Chengdu, Sichuan
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing CN Chengdu, Sichuan
- Agency: Ladas & Parry LLP
- Priority: CN201210011025 20120113
- International Application: PCT/CN2012/084469 WO 20121112
- International Announcement: WO2013/104209 WO 20130718
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/02 ; H01L29/786

Abstract:
Embodiments of the invention provide an oxide TFT and a manufacturing method thereof. The oxide thin film transistor comprises: a substrate; a gate electrode formed on the substrate; a gate insulation layer covering the gate electrode; an oxide active layer formed on the gate insulation layer and comprising a source region, a drain region, and a channel between the source region and the drain region; an etching barrier layer entirely covering the active layer and the gate insulation layer; and a source electrode and a drain electrode formed on the etching barrier layer and respectively provided on both sides of the channel. The etching barrier layer is a metal layer. The oxide thin film transistor further comprises a channel protective layer, which is a non-conductive oxidation layer converted from the metal layer by performing an oxidation treatment on the metal layer.
Public/Granted literature
- US20140061633A1 OXIDE TFT AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-03-06
Information query
IPC分类: