Invention Grant
- Patent Title: Heat exchanger
- Patent Title (中): 热交换器
-
Application No.: US13871575Application Date: 2013-04-26
-
Publication No.: US09353997B2Publication Date: 2016-05-31
- Inventor: Sehyeon Kim , Eungyul Lee
- Applicant: LG Electronics Inc.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Agency: Dentons US LLP
- Priority: KR10-2012-0044139 20120426
- Main IPC: F28F1/12
- IPC: F28F1/12 ; F28F1/32 ; F28F17/00 ; F28D1/053

Abstract:
Provided is a heat exchanger, which includes a plurality of flat tubes in which refrigerant flows, a fin including tube couplers in which the flat tubes are inserted, wherein the refrigerant exchanges heat with a fluid through the fin, and a header coupled to at least one side portion of the flat tubes and distributing the refrigerant to the flat tubes. The fin includes a first fin coupled to a part of the flat tubes, the part of the flat tubes constituting a first row, and a second fin provided on a side portion of the first fin and coupled to another part of the flat tubes, the another part of the flat tubes constituting a second row.
Public/Granted literature
- US20130284414A1 HEAT EXCHANGER Public/Granted day:2013-10-31
Information query