An electronic substrate connecting structure is used to electrically connect a pair of electronic substrates arranged to face each other. The electronic substrate connecting structure includes a plurality of pins erected on one of the electronic substrates to electrically connect the one of the electronic substrates and the other electronic substrate, and a pin guide that has a plurality of guide holes where the pins are inserted and defines positions of the pins such that the pins are connectable to the other electronic substrate while the pins are installed in the one of the electronic substrates.