Invention Grant
- Patent Title: Thermally-conductive elastic body
- Patent Title (中): 导热弹性体
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Application No.: US14131365Application Date: 2013-06-13
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Publication No.: US09335104B2Publication Date: 2016-05-10
- Inventor: Sewook Oh , Sanghyun Kim
- Applicant: LG ELECTRONICS INC. , E-SONG EMC CO., LTD.
- Applicant Address: KR Seoul KR Seoul
- Assignee: LG ELECTRONICS INC.,E-SONG EMC CO., LTD.
- Current Assignee: LG ELECTRONICS INC.,E-SONG EMC CO., LTD.
- Current Assignee Address: KR Seoul KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2012-0083926 20120731
- International Application: PCT/KR2013/005220 WO 20130613
- International Announcement: WO2014/021548 WO 20140206
- Main IPC: F28F21/02
- IPC: F28F21/02 ; H05K7/20 ; B32B3/04 ; B32B9/00 ; B32B9/04 ; F28F21/06 ; F28F13/00

Abstract:
Disclosed is a thermally-conductive elastic body that effectively dissipates heat generated from a heat generation source such as an electronic product and prevents a phenomenon in which small graphite fragments are separated from (fall off) a graphite layer by completely sealing up the graphite layer that conducts the heat. The thermally-conductive elastic body according to the embodiments of the present disclosure includes an elastic body and a thermally conductive layer that is formed to be wrapped around an external surface of the elastic body, in which the thermally conductive layer includes a first base film and a graphite layer that is internally arranged within an edge region of the first base film, and in which the edge region of the first base film is attached to the elastic body in such a manner that the graphite layer is sealed up.
Public/Granted literature
- US20140332193A1 THERMALLY-CONDUCTIVE ELASTIC BODY Public/Granted day:2014-11-13
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