Invention Grant
- Patent Title: Microphone module for electronic device
- Patent Title (中): 用于电子设备的麦克风模块
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Application No.: US14052111Application Date: 2013-10-11
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Publication No.: US09326057B2Publication Date: 2016-04-26
- Inventor: Jun-Tae Lee
- Applicant: Samsung Electronics Co. Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: KR10-2012-0117327 20121022
- Main IPC: H04R1/04
- IPC: H04R1/04 ; H04R1/08 ; H04M1/03 ; H04R1/28

Abstract:
A microphone module for an electronic device is provided. The microphone module includes a window having at least one microphone hole in a part of an edge of the window, a microphone installed in a position corresponding to the microphone hole of the window, and a case frame coupled with the window and forming an appearance of the electronic device. The microphone module receives an external voice through the microphone hole of the window.
Public/Granted literature
- US20140112518A1 MICROPHONE MODULE FOR ELECTRONIC DEVICE Public/Granted day:2014-04-24
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