Invention Grant
US09316767B2 Method of manufacturing microlens array substrate, microlens array substrate, electro-optic device, and electronic
有权
微透镜阵列衬底,微透镜阵列衬底,电光器件和电子的制造方法
- Patent Title: Method of manufacturing microlens array substrate, microlens array substrate, electro-optic device, and electronic
- Patent Title (中): 微透镜阵列衬底,微透镜阵列衬底,电光器件和电子的制造方法
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Application No.: US14480984Application Date: 2014-09-09
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Publication No.: US09316767B2Publication Date: 2016-04-19
- Inventor: Yoshikazu Eguchi
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: ALG Intellectual Property, LLC
- Priority: JP2013-201053 20130927
- Main IPC: G02B3/00
- IPC: G02B3/00 ; G03B21/00 ; G02F1/1335 ; G03B21/20 ; G03B33/12

Abstract:
There is provided a method of manufacturing a microlens array substrate with improved manufacturing yield and high quality, the method including: forming a groove part along an outer edge of a first area on a surface of a substrate; forming a mask layer to cover a side of the surface, forming a plurality of openings in the first area, and forming openings along the outer edge of the first area; performing isotropic etching on the substrate through the mask layer, forming a plurality of recesses in the first area, and forming recesses across a boundary part between the first area and the groove part; removing the mask layer from the substrate; forming a light transmission material layer that has a refractive index, which is different from a refractive index of the substrate, to cover the side of the surface of the substrate and to bury the plurality of recesses; and planarizing an upper surface of the light transmission material layer.
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