发明授权
- 专利标题: Scheme for 3D voltage type TSV signal transmission
- 专利标题(中): 3D电压型TSV信号传输方案
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申请号: US14146017申请日: 2014-01-02
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公开(公告)号: US09312856B2公开(公告)日: 2016-04-12
- 发明人: Meng-Fan Chang , Tsung-Hsien Huang , Pei-Yuan Li
- 申请人: National Tsing Hua University
- 申请人地址: TW Hsin Chu
- 专利权人: National Tsing Hua University
- 当前专利权人: National Tsing Hua University
- 当前专利权人地址: TW Hsin Chu
- 代理机构: Huntington IP Consulting Co., Ltd.
- 代理商 Chih Feng Yeh
- 主分类号: H03K19/003
- IPC分类号: H03K19/003 ; H03K19/08 ; H03K19/00
摘要:
A method for 3D voltage type TSV signal transmission, comprising transmitting a full swing signal of data with a first voltage through TSVs for each one of a plurality of slave devices to determine a transmission time required for data transmission to a master device. Then, full swing signal is sensed by the master device for reduce the first voltage to be a small swing signal with lower voltage. Logic “0” signals or logic “1” signals with the lower voltage are transmitted through the TSVs by the plurality of slave devices. It is sharing charge and balancing voltage level to a mean value for the logic “1” signals or the logic “0” signals by the master device.
公开/授权文献
- US20150188540A1 Scheme for 3D Voltage Type TSV Signal Transmission 公开/授权日:2015-07-02
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