Provided herein are a method and apparatus for the formation of conductive films on a substrate using precise sintering of a conductive film and thermal management of the substrate during sintering. In particular, a method may include depositing a conductive metal-based ink on a translucent or transparent substrate, positioning a mask between the deposited conductive metal-based ink and a light source, exposing the mask and the underlying deposited conductive metal-based ink to the light source, sintering the conductive metal-based ink exposed to the light source, and cleaning the non-sintered conductive metal-based ink from the translucent or transparent substrate. The mask may be configured to shield at least a portion of the conductive metal-based ink from the light source. The portion of the conductive metal-based ink shielded from the light source may remain non-sintered in response to the sintering of the conductive metal-based ink exposed to the light source.