发明授权
- 专利标题: Composition for tungsten buffing
- 专利标题(中): 钨粉抛光组成
-
申请号: US14222086申请日: 2014-03-21
-
公开(公告)号: US09309442B2公开(公告)日: 2016-04-12
- 发明人: Lin Fu , Jeffrey Dysard , Steven Grumbine
- 申请人: Cabot Microelectronics Corporation
- 申请人地址: US IL Aurora
- 专利权人: Cabot Microelectronics Corporation
- 当前专利权人: Cabot Microelectronics Corporation
- 当前专利权人地址: US IL Aurora
- 代理商 Thomas Omholt; Arlene Hornilla; Christopher C. Streinz
- 主分类号: C09G1/02
- IPC分类号: C09G1/02 ; C23F3/03 ; B24B37/04 ; C23F3/06
摘要:
A chemical mechanical polishing composition for polishing a substrate having a tungsten layer includes a water based liquid carrier and colloidal silica abrasive particles dispersed in the liquid carrier. The colloidal silica abrasive particles have a permanent positive charge of at least 6 mV. About 30 percent or more of the colloidal silica abrasive particles include three or more aggregated primary particles.
公开/授权文献
- US20150267081A1 COMPOSITION FOR TUNGSTEN BUFFING 公开/授权日:2015-09-24
信息查询