发明授权
- 专利标题： Solder, solder joint structure and method of forming solder joint structure
- 专利标题（中）： 焊接，焊点结构及形成焊点结构的方法
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申请号： US13855719申请日： 2013-04-03
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公开(公告)号： US09308603B2公开(公告)日： 2016-04-12
- 发明人: Kuo-Shu Kao , Tao-Chih Chang , Wen-Chih Chen
- 申请人： Industrial Technology Research Institute
- 申请人地址： TW Hsinchu
- 专利权人： Industrial Technology Research Institute
- 当前专利权人： Industrial Technology Research Institute
- 当前专利权人地址： TW Hsinchu
- 代理机构： Jianq Chyun IP Office
- 优先权： TW101142671A 20121115
- 主分类号： B32B15/20
- IPC分类号： B32B15/20 ; B23K35/24 ; B32B15/01 ; B23K35/28 ; B23K35/30 ; H01L23/495 ; H01L23/00 ; H01L23/373 ; H01L25/065
摘要：
A solder and a solder joint structure formed by the solder are provided. The solder includes a zinc-based material, a copper film, and a noble metal film. The copper film completely covers the surface of the zinc-based material. The noble metal film completely covers the copper film. The solder joint structure includes a zinc-based material and an intermetallic layer. The intermetallic layer consists of zinc and noble metal and completely covers the surface of the zinc-based material.
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