发明授权
- 专利标题: Heat-transfer structure
- 专利标题(中): 传热结构
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申请号: US14491360申请日: 2014-09-19
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公开(公告)号: US09308571B2公开(公告)日: 2016-04-12
- 发明人: Roger Scott Kempers , Shankar Krishnan , Alan Michael Lyons , Todd Richard Salamon
- 申请人: Alcatel Lucent
- 申请人地址: FR Boulogne-Billancourt
- 专利权人: Alcatel Lucent
- 当前专利权人: Alcatel Lucent
- 当前专利权人地址: FR Boulogne-Billancourt
- 代理机构: Hitt Gaines, P.C.
- 主分类号: H01L23/42
- IPC分类号: H01L23/42 ; B21D53/02 ; H01L23/367 ; H01L23/00 ; H01L25/065 ; F28F21/00 ; H01L23/373
摘要:
An apparatus comprising a first substrate having a first surface, a second substrate having a second surface facing the first surface and an array of metallic raised features being in contact with the first surface to the second surface, a portion of the raised features having a mechanical bend or buckle plastic deformation produced therein via a compressive force. One or more of the metallic raised features has one or more surface singularities therein prior to the mechanical bend or the buckle plastic deformation produced by the compressive force.
公开/授权文献
- US20150014841A1 HEAT-TRANSFER STRUCTURE 公开/授权日:2015-01-15
信息查询
IPC分类: