Invention Grant
- Patent Title: Boiling heat transfer device
- Patent Title (中): 沸腾传热装置
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Application No.: US13128740Application Date: 2009-10-22
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Publication No.: US09297589B2Publication Date: 2016-03-29
- Inventor: Hitoshi Sakamoto , Minoru Yoshikawa , Takeya Hashiguchi
- Applicant: Hitoshi Sakamoto , Minoru Yoshikawa , Takeya Hashiguchi
- Applicant Address: JP Tokyo
- Assignee: NEC CORPORATION
- Current Assignee: NEC CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2008-294282 20081118
- International Application: PCT/JP2009/005577 WO 20091022
- International Announcement: WO2010/058520 WO 20100527
- Main IPC: F28D15/00
- IPC: F28D15/00 ; F28D15/02 ; H01L23/427

Abstract:
A boiling heat transfer device of the present invention includes: a heat receiving portion that boils a liquefied refrigerant to convert it to vapor, and contacts with a device to be cooled and cools the device to be cooled; a vapor tube that connects to an upper portion of the heat receiving portion and conveys the vapor generated by the heat receiving portion; a heat dissipating portion that condenses the vapor conveyed from the vapor tube to convert it to a liquefied refrigerant and dissipates heat to an atmosphere; and a liquid tube that returns to the heat receiving portion the liquefied refrigerant condensed by the heat dissipating portion. At least a portion of a cross-sectional area of a flow passage of the vapor in the heat receiving portion gradually decreases from a lower portion of the heat receiving portion toward the upper portion of the heat receiving portion.
Public/Granted literature
- US20110214840A1 BOILING HEAT TRANSFER DEVICE Public/Granted day:2011-09-08
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