发明授权
- 专利标题： Wafer level packaging bond
- 专利标题（中）： 晶圆级包装贴
-
申请号： US14170455申请日： 2014-01-31
-
公开(公告)号： US09293445B2公开(公告)日： 2016-03-22
- 发明人: Ping-Yin Liu , Li-Chen Chu , Hung-Hua Lin , H. T. Huang , Jung-Huei Peng , Yuan-Chih Hsieh , Lan-Lin , Chun-Wen Cheng , Chia-Shiung Tsai
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Haynes and Boone, LLP
- 主分类号： H01L25/16
- IPC分类号： H01L25/16 ; B81C1/00 ; H01L21/18
摘要：
A device is described in one embodiment that includes a micro-electro-mechanical systems (MEMS) device disposed on a first substrate and a semiconductor device disposed on a second substrate. A bond electrically connects the MEMS device and the semiconductor device. The bond includes an interface between a first bonding layer including silicon on the first substrate and a second bonding layer including aluminum on the second substrate. The physical interface between the aluminum and silicon (e.g., amorphous silicon) can provide an electrical connection.
公开/授权文献
- US20140138853A1 WAFER LEVEL PACKAGING BOND 公开/授权日：2014-05-22
信息查询
IPC分类:
