Invention Grant
- Patent Title: Ultracapacitor vacuum assembly
- Patent Title (中): 超级电容真空组件
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Application No.: US14087761Application Date: 2013-11-22
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Publication No.: US09293268B2Publication Date: 2016-03-22
- Inventor: John Paul Krug , Kamjula Pattabhirami Reddy , James Scott Sutherland , Todd Marshall Wetherill
- Applicant: Corning Incorporated
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agent John L. Haack; Michael W. Russell
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01G11/32 ; H01G11/86 ; H01G11/28 ; H01G13/04

Abstract:
A method for fabricating an EDLC includes (a) coating a porous activated carbon material onto current collector sheets to form carbon-based electrodes, (b) drying the carbon-based electrodes, (c) winding or stacking carbon-based electrodes interleaved with separator sheets to fabricate a jelly roll or prismatic electrode assembly, (d) inserting the electrode assembly into a package and forming electrical connections between the electrode assembly and package terminals, (e) filling the package with a liquid electrolyte, and (f) sealing the package. Steps (a)-(f) are performed in an atmosphere having a low moisture content. The atmosphere may be vacuum or purged with dry gas.
Public/Granted literature
- US20150143680A1 ULTRACAPACITOR VACUUM ASSEMBLY Public/Granted day:2015-05-28
Information query
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