发明授权
- 专利标题： Chip package including a microphone structure and a method of manufacturing the same
- 专利标题（中）： 包括麦克风结构的芯片封装及其制造方法
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申请号： US14446361申请日： 2014-07-30
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公开(公告)号： US09290379B2公开(公告)日： 2016-03-22
- 发明人: Horst Theuss
- 申请人： Infineon Technologies AG
- 申请人地址： DE Neubiberg
- 专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人地址： DE Neubiberg
- 主分类号： H01L27/00
- IPC分类号： H01L27/00 ; B81C1/00 ; B81B3/00 ; H01L29/84 ; H04R1/08
摘要：
In various embodiments, a method for manufacturing a chip package is provided. The method includes arranging a chip over a substrate, the chip including a microphone structure and an opening to the microphone structure; and encapsulating the chip with encapsulation material such that the opening is kept at least partially free from the encapsulation material.
公开/授权文献
- US20140332912A1 CHIP PACKAGE AND A METHOD OF MANUFACTURING THE SAME 公开/授权日：2014-11-13
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