Invention Grant
- Patent Title: Expansion chuck
- Patent Title (中): 膨胀卡盘
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Application No.: US13723027Application Date: 2012-12-20
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Publication No.: US09289831B2Publication Date: 2016-03-22
- Inventor: Josef K. Herud , Ruy Frota de Souza Filho
- Applicant: Kennametal Inc.
- Applicant Address: US PA Latrobe
- Assignee: KENNAMETAL INC.
- Current Assignee: KENNAMETAL INC.
- Current Assignee Address: US PA Latrobe
- Agent Larry R. Meenan
- Main IPC: B23B31/30
- IPC: B23B31/30 ; B23B31/12 ; B23B31/117

Abstract:
The invention relates to a hydraulic expansion chuck with a basic body, with an expansion bush which is received in the basic body and defines a reception space for a tool to be chucked, and with a pressure chamber which is delimited between the expansion bush and the basic body, at least one solder region being provided, in which the expansion bush is soldered to the basic body, wherein, between the pressure chamber and the solder region, a seal is provided which is formed by an at least essentially fluid-tight bearing contact of the expansion bush against the basic body.
Public/Granted literature
- US20140175760A1 Expansion Chuck Public/Granted day:2014-06-26
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